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The semiconductor industry’s unwavering commitment to quality and precision is driven by technological requirements and global competition. Maintaining stringent standards in all aspects of semiconductor design and manufacturing is essential for delivering reliable and high-performance devices to the market. The quality of semiconductors is intricately tied to the efficacy of testing processes and quality control measures. Test wafers are meticulously inspected and validated at every stage of semiconductor fabrication.

The increasing demand for electronic equipment is driven by factors such as the escalation of digital transformation, consumer electronics, IoT, automotive electronics, industrial automation, communication infrastructure, and emerging technologies. Semiconductors serve as the foundation for these technologies, enabling the development of advanced and interconnected electronic devices that cater to diverse industry needs.

Three-dimensional integrated circuits (3DICs) have emerged as a promising solution to meet the increasing demands for high performance and compactness in modern applications. By stacking individual ICs/wafers together as a single package, 3DIC technology offers several advantages over traditional two-dimensional (2D) integrated circuits.

Semiconductor companies encounter substantial expenses in constructing facilities and acquiring equipment, resulting in a capital-intensive industry. To remain competitive and keep up with the most recent technological advancements, semiconductor companies must continually discover innovative ways to optimize their spending and reduce capital expenses without jeopardizing the quality, and effectiveness of their technology and equipment investments.

Efficient management of the substrate has been a key factor in the progress of modern electronic civilization, enabling the creation of compact high-performance devices. The development of 3D IC stacking has been facilitated by the reduction in substrate thickness, which allows several ICs to be squeezed and stacked as a single package. However, handling ultrathin wafers and reducing wafer thickness without damaging the pre-process has been a challenging task for semiconductor industries. Temporary bonding and debonding (TBDB) technology was developed to address this.

The advancements in AI technology have indeed driven improvements in processing units, and these improvements often extend to the overall fabrication process of semiconductor devices. The demand for more powerful and efficient hardware to support AI workloads has led to the development of specialized accelerators. Graphics Processing Units (GPUs), Tensor Processing Units (TPUs), High Bandwidth Memory (HBM) and other custom-designed chips are being used to accelerate specific AI computations. The fabrication of these specialized chips involves advanced semiconductor manufacturing processes.