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Debonding-Pyxis FDB & TDB Series

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Debonding
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Scientech, in collaboration with international leader 3M, has developed the Pyxis series Debonding Equipment, including Frame Debonding Equipment and Taiko Debonding Equipment, providing solutions for glass debonding processes in wafer thinning and BGBM (Backside Grinding & Backside Metallization).

  • High-efficiency production equipment
  • Lower consumables cost (Low CoO)
  • No wafer cleaning required after debonding
  • The Pyxis series debonding equipment can be applied in:
  • lSemiconductor wafer thinning
  • lBGBM (Backside Grinding & Backside Metallization)
  • lCompound semiconductor wafer thinning (SiC/GaN)
  • Its applicable process is:
  • lFrame debonding
  • lTaiko debonding

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